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Intel Home > IDF Global Site > PRC IDF Site > Beijing > Technical Training Sessions |
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Intel Developer Forum |
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| April 18-19 |
| Beijing International Convention Center |
Hotline: 800-990-6688 |
| Mayl 23-24 |
| Shenzhen Wuzhou Guest House |
E-mail: IDF@9500.CN |
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Technical Training Sessions |
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Intel Innovation in Embedded and Communication Infrastructure Platform
| Track Abstract : |
This track talks about dual core and *T design in embedded solutions and next generation communication infrasturcture solutions. Obtain in-depth technical knowledge on Intel’s latest solutions for embedded and communications infrastructure applications, including Car-PC,POS System, Intel(R) Multi-core Processor and ATCA technology, etc. |
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| Target Audiences : |
This track is designed for product marketers, R&D managers, developers/designers and/or audiences showing high interest in learning Intel Embedded and Communication Infrastructure platform technologies, solution supports and trends. |
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| Session Guides: |
★
★★
★★★
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Introductory: A Starting Point Class
Intermediate: For Attendees With A Base Knowledge of the Topic
Advanced: Assumes Mastery of the Fundemental Principles |
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Date |
Time&Session ID |
Session Content |
April 19 |
13:30-14:20
BEIS001 |
Intel® Embedded Compact Extended Form Factor (Intel ECX Form Factor) for In-vehicle Infotainment solutions ★★ ( Download Session Foils )
Speaker introduction : Giap Yong Ooi,Technical Marketing Engineer, Infrastructure Processor Division of Digital Enterprise Group,Intel Corporation |
This session will present key technical contributions from Intel for the in-vehicle infotainment segment. Intel ECX form factor is a new small form factor which is suitable for 1-DIN solutions in in-vehicle infotainment systems. This session will present the marketing plans and expected technical support from IPD to promote Intel ECX form factor in this segment and solutions.
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14:30-15:20
BEIS002 |
Embedded platform with multi-core Intel processor architecture: performance analysis and optimization methodology ★★ ( Download Session Foils )
Speaker introduction : Loo Shing Tan,Platform Solution Architecture Manager,Infrastructure Processor Division,Intel Corporation |
| The session will discuss the performance analysis and optimization methodology on embedded platform with multi-core architecture. In this session, audience will be shared with technical details on dual-core Intel processor, performance analysis and optimization methodology with Intel software tools. |
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15:30-16:20
BEIS003 |
Utilizing Virtualization Technology and Active Management Technology in Point of Sales enterprise system using "Intel® Core TM Duo processor and Mobile Intel® 945GM Express Chipset" Platform. ★ ( Download Session Foils )
Speaker introduction : Giap Yong Ooi,Technical Marketing Engineer, Infrastructure Processor Division of Digital Enterprise Group,Intel Corporation |
| This session is to provide the audience a proof of concept demo and methodology for utilizing both Virtualization Technology (VT) and Active Management Technology (AMT) in retail segment especially point of sales (POS) system. It is utilizing the latest "Intel® Core TM Duo processor and Mobile Intel® 945GM Express Chipset" solutions. |
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16:30-17:20
BEIS004 |
ATCA - Open Telecom Computing Platform for Independpent Innovation ★★ ( Download Session Foils )
Speaker introduction : Dimo Xie,Market Development Manager,Product Platform Marketing Group,Intel Corporation |
Advanced Telecommunication Computing Platform provide the foundation for telecom infrastructure environment. This open modular platform bring faster time to market, lower development and manufacture cost for new telecom equipment. Intel and ecosystem partners are leading the modular transition. We will introduce Intel product strategy, platform solution and success story about ATCA platform. Attendees will gain understanding of the opportunities to develop independpent innovation telecom equipment based on ATCA.
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| * Intel (China) Co., Ltd. reserves all rights to explain the above terms. |
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