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Intel Developer Forum

April 17-18 | Beijing, China | Beijing International Convention Center
Technical Training Sessions
Intel Innovation in Embedded Designs and Solutions
Track Abstract : Thermal issues, performance/power balance and multi-function/multi-core optimization are always major challenges when engineers design embedded products. Here is your opportunity to learn and gather in-depth technical knowledge on Intel's latest embedded solutions for "Small Office Home Office" (SOHO) IP service devices,  fanless designs and security appliances.